Bechtel lands EPC contract for Micron's $100bn New York plant

Micron Technology, an American multinational semiconductor company, has selected Bechtel as its engineering, procurement and construction (EPC) partner for the first phase of its $100 billion memory manufacturing campus in Clay, New York.  

Once completed, it is set to become the nation's largest semiconductor manufacturing facility. 

Since breaking ground on its first New York fab in January 2026, Micron has made strong progress and is now transitioning to the next phase of construction with Bechtel, said Micron in a statement. 

The project represents the largest private investment in New York state history, projected to add approximately $16.7 billion per year in real economic output in the state and approximately $5.4 billion per year in personal income for New Yorkers over the next 30 years.

Micron’s leading-edge memory manufacturing complex is expected to generate 50,000 jobs in New York, including over 4,500 construction jobs. At peak construction, the work will support thousands of skilled craft professionals, creating opportunities for union trades, apprentices, local training program graduates, specialty contractors, suppliers and construction professionals across New York. 

As Micron and Bechtel build out their project team and supply chain, they plan to conduct community outreach to help develop the local supply chain and trade labor ecosystem needed to build these fabs, ensuring state and local businesses and job-seekers are poised to benefit from the work ahead, said the statement. 

For every direct Micron hire, there would be almost six other jobs created in the state economy, it added.

"Our New York project will be home to the most advanced memory manufacturing in the world and will serve as a cornerstone of America's leadership in the AI era," remarked Manish Bhatia, the Executive Vice President of Global Operations at Micron Technology. 

"We are entering an exciting new phase of construction. As the only U.S. manufacturer of memory, we know a project of this scale and complexity is only possible through the strength of partnership, and we are pleased to partner with Bechtel - unlocking the full strength of their global capabilities, technical expertise and world-class teams - to bring this facility to life," he added. 

Craig Albert, Bechtel’s president & chief operating officer, said this project represents more than the construction of a semiconductor manufacturing campus, it is part of the foundation of America’s industrial future.

"Micron is making a generational investment in US manufacturing, and Bechtel is bringing its world-class execution to deliver the foundation of long-term technology leadership and economic growth," he added. 

Semiconductor fabrication facilities rank among the most technically demanding industrial projects in the world, requiring precision construction across cleanroom systems, ultra-high-purity process infrastructure, advanced electrical systems, vibration-sensitive foundations, and tightly controlled manufacturing environments. 

Bechtel will deploy an integrated EPC delivery model combining engineering, procurement, advanced digital-enabled construction technologies, modularisation strategies and sophisticated project controls to support schedule confidence, workforce co-ordination and operational readiness. The project supports broader efforts to expand US semiconductor manufacturing capacity and strengthen the resilience of America’s technology supply chain.